HuaXin Electronics Technology
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End-to-End Manufacturing Capabilities

One integrated facility for PCB fabrication, assembly, sourcing and testing. Our engineering team reviews every file before production starts.

PCB Fabrication

1–32 layers, HDI, rigid-flex, high-frequency materials.

SMT & THT Assembly

01005–BGA, mixed technology, 10 SMT lines.

Components Sourcing

Global distributors, genuine parts, flexible quantities.

Turnkey EMS

From Gerber & BOM to tested, ready-to-ship boards.

Prototype & NPI

24h prototypes and smooth scale-up to volume.

Testing & Box Build

AOI, X-Ray, ICT, FCT plus full system assembly.
Multilayer PCB fabrication
Service 01

PCB Fabrication

Our factory fabricates advanced boards for every application — from simple 2-layer boards to complex 32-layer HDI and rigid-flex stacks.

  • FR-4, Rogers, PTFE and metal-core (IMS) materials
  • HDI with micro-vias, blind & buried vias, back-drilling
  • Surface finishes: HASL, ENIG, OSP, immersion silver/tin, ENEPIG
  • Controlled impedance and impedance testing on request

Fabrication Capability

Layer Count1 – 32 layers
Min. Trace / Space3 / 3 mil
Min. Drill Hole0.15 mm
Max. Board Size610 × 610 mm
Board Thickness0.2 – 6.0 mm
Impedance Tolerance±5%
SMT pick-and-place assembly
Service 02

SMT & THT Assembly

Ten automated SMT lines with high-speed placement machines handle everything from 01005 chips to large BGAs, including mixed-technology THT.

  • 01005 through BGA, CSP, QFN, QFP, connector & press-fit
  • Lead-free and leaded soldering, selective & wave soldering
  • Conformal coating, potting and underfill on request
  • Full AOI on every line, X-Ray on BGA and press-fit

Assembly Capability

Placement SpeedUp to 120,000 CPH
Min. Component01005 (0.4 × 0.2 mm)
BGA Pitch0.3 mm
Board SizeMax 610 × 610 mm
Solder TypeLead-free (SAC305) / leaded
Daily Output1.5M+ placements
Electronic component reels
Service 03

Components Sourcing

Our procurement team manages thousands of BOM lines a month through trusted distribution partners — securing genuine parts at competitive prices, even for small batches.

  • IC, passive, connector and enclosure sourcing worldwide
  • Genuine-only policy with vendor qualification & lot traceability
  • BOM cost-down review and alternate-part suggestions
  • Consignment option — you supply parts, we handle the rest
Partners Arrow · Digi-Key · Mouser · WPG
Min. Order Qty1 pc for prototype / low MOQ for volume
Lead Time1 – 15 days
Quality Check100% IQC on critical parts
Counterfeit ProtectionMulti-source verification + X-Ray for high-risk parts
Full PCBA turnkey production line
Service 04

Turnkey EMS

One contract, one account manager, one invoice. We take full responsibility for your boards from raw material to the shipping dock — you just approve the quote.

  • Board + components + assembly + testing in one price
  • Simplified logistics — one part number per finished assembly
  • OEM & ODM support with NDA protection from day one
  • Flexible volume: 1–5 pc samples up to 1M+ piece runs

What's Included

EngineeringDFM / DFA / Gerber check
MaterialsFull BOM procurement
ManufacturingPCB + SMT + THT + coating
TestingAOI · X-Ray · ICT · FCT
PackagingVacuum · ESD · export carton
DocumentationQC reports · COC · traceability
Prototype debugging bench
Service 05

Prototype & New Product Introduction

Get from idea to first article in days. Our NPI team manages the full journey — quoting, DFM, sample build, validation and ramping to volume without losing momentum.

  • 24-hour express prototype for standard boards
  • Free stencil for first NPI run, test-fixture support
  • Design-for-manufacture feedback that prevents re-spins
  • Engineering change support during the ramp phase

NPI Turnaround

PCB Prototype24 – 48 hours
SMT Sample1 – 3 days
Small Series3 – 7 days
Mass Production7 – 15 days
In-circuit test fixture
Service 06

Testing & Box Build

Quality is verified, not assumed. Every assembly passes automated inspection, and we offer full box-build with functional system testing before any shipment.

  • SPI → AOI → X-Ray → ICT → FCT inspection chain
  • ICT and flying-probe test fixtures built in-house
  • Box build, cabling, burn-in and aging tests
  • Functional test programs co-developed with your team
SPI AOI X-Ray ICT FCT Burn-in
SPI3D solder-paste inspection on all lines
AOI100% post-reflow on both sides
X-RayBGA, QFN and hidden solder joints
ICT / FCTIn-circuit & functional testing per spec

Not Sure Which Service You Need?

Send your files and let our engineers recommend the most cost-effective path to production.

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